Uyemura, the industry leader in electroless nickel plating and plating control, has introduced STARLiNE-DASH 4-NP, the newest and most advanced process control technology for EN plating.
DASH 4-NP samples the electroless nickel plating solution, analyzes nickel and pH values, and replenishes automatically. As a result, baths can be maintained continuously at 2-4% of optimum, nickel can be controlled within +/-0.05 g/L, and overall plating rate can usually be increased.
It also offers these 10 important advantages:
UL listing is pending
STARLiNE-DASH 4-NP operators review system history, establish sampling schedules, calibrate bath sensors, and specify tolerances; the system does the rest.
As a result:
RP-2 Flow-Thru Electrolytic Plating System for SMT Micro Components
Plates as Small as 50µm Without Agglomeration
This fully automatic plater uses high speed rotation and centrifugal force to optimize electrical contact between the plating material and cathode, It also uses inertia when the equipment brakes to a rapid stop to force fluid mixing of the plating material. This ensures a homogeneous deposit thickness, as well as high current density operation that is substantially greater than what’s technically possible with conventional barrel plating. The RP-2 is ideal for electrolytic plating of nickel, tin and copper plating, as well as fine powders.
|ENIG / ENEPIG|
|UBM - Aluminum|
|UBM - Copper|
|Black Nickel Finishes|
|Electroless Gold, Other
|Plasma Conformal Coating|
|Connector / Sensor Finishes|
|Healthcare / Food
|Platinized / MMO Anode|
|News & Videos|