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Uyemura
– our
central research
labs in Hirakata (a suburb of Osaka,
Japan) have over 70 full time R&D
professionals dedicated exclusively
to the development and optimization
of functional and decorative plating
chemistries.
Our Taiwan company has nearly a dozen
additional R&D
professionals assigned to new product
development. Uyemura-USA
opened
its Southington, CT facility in 1999, becoming the third facility
focused on product innovation.
What Are Our Newest Developments?
Uyemura ANP Electroless Nickel Plating for Aluminum –
an important new technology that uses Uyemura’s lead and
cadmium-free electroless nickel product with proprietary
cleaning, etching and zincating technologies to deliver
excellent adhesion through six or more MTOs.
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Presa RMK-30 Immersion Tin
– for PWB and PKG – a fluoride-free
immersion tin that provides excellent solderability – even with
high-temp, lead-free solders.
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MEC Company LTD
– an Osaka
company providing Uyemura customers
access to 35 more R&D professionals specializing
in products for
the printed circuit and semiconductor
industries.
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Umicore-GT
– their
Schwbisch Gmund, Germany facility
benefits Uyemura customers with access
to a team of 35 R&D
professionals. This team is credited
with the development
of industry-leading processes for electroplating
gold, silver,
rhodium, ruthenium and decorative plating — as well
as the
non-precious Miralloy,Dialloy, and Niphos chemistries.
Also
among their credentials is the development of
revolutionary
Platinode anodes.
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CL
Technology –
this Solingen, Germany company provides
Uyemura-USA customers with access to
the world’s most advanced
and efficient decorative plating chemistries.
CL Technologies' satin
nickel is a market leader in the U.S.
and we expect their SN1
tin-nickel process to do equally well. |
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New
Surface Technologies
– this Bedford, OH company offers
the latest in zinc, chromates and
other decorative plating processes.
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RBP
Chemical Company –
based in Milwaukee, WI, this firm
produces tin and solder strippers
as well as mist suppressors and
multiple cleaners used in the printed
circuit industry.
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Network
Electronic Marketing
– Phoenix, AZ provides the
EZ-Plate technology that is revolutionizing
acid copper plating in
the printed circuit industry. EZ-Plate
lowers costs while
providing higher quality finished
product.
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Uyemura specializes in electroless nickel / immersion gold, decorative
black nickel, HASL alternative products, immersion silver, lead and
cad-free finishes, electroless nickel, diamond reflective finishes, and
alternatives to black oxide.
Other industry-leading UIC finishes are acid copper DC electroplate,
ENIG, ENAG, gold wire bonding, electrolytic nickel gold, immersion silver,
immersion tin, and under bump metallization processes for aluminum and
aluminum alloys, and copper.
Corporate Headquarters:
3990 Concours, #425 • Ontario, CA 91764 • ph: (909) 466-5635
Tech Center:
240 Town Line Road • Southington, CT 06489 • ph: (860) 793-4011
© Copyright 2010. Website designed by www.marketingservicesinc.com
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