EPIG nickel-free PCB finish is gold wire bondable, solderable, ideal for HF use
EPIG (Electroless Palladium, Immersion Gold) from Uyemura has opened up a wide, new design avenue for high frequency applications and designs with reduced spacing. The EPIG process deposits palladium directly onto copper. More
Industry’s deepest black finish, with exceptional hardness and high density topography. An entirely new film “shape” with extraordinary micro-uniformity and corrosion resistance. More
TAM-55 advanced immersion gold bath minimizes nickel corrosion, optimizes gold distribution; the ultimate gold for ENIG and ENEPIG. More
Uyemura President and CEO Tony Revier (shown left, with his wife Mary Anne) has twice been recognized by his alma mater, the University of La Verne, (La Verne, CA), an institution widely known for its influential business and public management programs.
Revier was honored as one of the University’s 125 Most Notable Graduates at a ceremony commemorating the 125th anniversary of the university. More