Uyemura provides exceptional, problem-solving finishing technology solutions, including the
broadest range of PCB finishes, ENIG, ENEPIG, ENAG, and much more.
UIC’s ENEPIG process is the ultimate solution for IC package PCB substrates, particularly ceramic-based SiP products.
ENEPIG’s pd plates via chemical reduction, so there’s no opportunity for EN layer compromise. UIC ENEPIG helps prevent BGA fractures, can replace the SIT used for HDI cellular phone PCBs.
Pure Palladium vs.
Uyemura supplies both.
Each customer is unique,
so we recommend
solutions based solely on
Read about Pd vs. PdP
EVF-N DC Via Fill
Thru-Cup EVF-N plates copper
in through-holes and blind
vias simultaneously, cutting
process time by 50%. It
delivers exceptional perfor-
mance for blind via diameters
smaller than 150 micrometers.
Uyemura Has a New Sales Manager
March 14, 2016. Uyemura Director of Operations Don Walsh announces the appointment of Robert Coleman as UIC Midwest Sales Manager, effective today. Coleman will be based in Chicago, with responsibility for UIC activities throughout Illinois, Wisconsin, Minnesota, Colorado, Texas, Ohio and Michigan.
Coleman is a 33-year veteran of the PCB industry, with extensive experience in manufacturing and operations as well as global account management. He is recognized as an expert in wet process chemistries and through-hole metallization.