"Powered by science, focused on customers."

Uyemura provides exceptional, problem-solving finishing technology solutions, including the
broadest range of PCB finishes, ENIG, ENEPIG, ENAG, and much more.



UIC’s ENEPIG process is the ultimate solution for IC package PCB substrates, particularly ceramic-based SiP products.

ENEPIG’s pd plates via chemical reduction, so there’s no opportunity for EN layer compromise. UIC ENEPIG helps prevent BGA fractures, can replace the SIT used for HDI cellular phone PCBs.

Pure Palladium vs.

Uyemura supplies both.
Each customer is unique,
so we recommend
solutions based solely on
your application.
Read about Pd vs. PdP

EVF-N DC Via Fill
Thru-Cup EVF-N plates copper
in through-holes and blind
vias simultaneously, cutting
process time by 50%. It
delivers exceptional perfor-
mance for blind via diameters
smaller than 150 micrometers.


UIC Boosts Western States Resources

Uyemura Director of Operations Don Walsh announces the appointment of Patrick Valentine as Manager of Six Sigma & Business Development. This new position combines leadership of a 'Tier 1' business initiative with responsibility for a key territory. The territory includes UIC's largest customer, and the Pacific Northwest.

Valentine is a 35-year veteran of the PCB and chip industries; most recently, he was Global Director of Lean Six Sigma and Technology Excellence for OM Group Electronic Chemicals Division.




UYEMURA Corporate Headquarters:

3990 Concours, #425 • Ontario, CA 91764 • ph: (909) 466-5635


Semiconductor Finishes:  
General Metal Finishes:  



UIC's George Milad discusses the latest developments in Vertical Acid Copper Plating in the December issue of Products Finishing.

Visit us at booth #212

Visit us at booth #609

visit us at (Europlasma) booth 549