Newsletters, Articles and Literature

 
NSS Performance Test UMICORE Antitarnish 616 Plus
 

Click for the summary PDF

 
Platinized Titanium and MMO Anodes in Electroplating Applications
 

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Electrolytic Nickel-Phosphorus Plating
 

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New Nickel Phosphorus Electrolytes Make Plating Jobs Easier
 

Business Development Manager Rich DePoto discusses the significance of new electrolytic nickel-phos technology for manufacturers of high frequency wireless devices with Modern Metals writer Lynn Stanley.
Click to read

 
Bright Lights, Big Finish for Electronics Plater
 

Products Finishing Editor Tim Pennington profiles Berquist Company, the only facility in the world dedicated exclusively to the production of insulated metal substrates, a thermal management solution for higher watt-density surface mount applications.
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EN Plating Control Technology
 

Brochure describes STARLiNE DASH technology for automated sampling, analysis and replenishment of EN baths with exceptional accuracy.
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Advanced Plasma Technology
 

Uyemura International Corporation and Europlasma NV (Oudenaarde, Belgium) have brought advanced vacuum plasma treatment technology (Nanofics®) to electronic manufacturing companies (EMS) and board makers in the US, Canada and Mexico.
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Surface Performance Newsletter
Spring 2016 Surface Performance Newsletter  

Fall 2016 GMF Newsletter profiles Chicago’s Precision Plating, a leader in electrolytic and electroless finishing, and describes its successes in the world’s most competitive markets. In a detailed editorial, Business Development Manager Rich DePoto discusses the sometimes-unanticipated reasons customers buy products.
View the PDF / View previous newsletter

 
ClearSignals Newsletter
 

Latest “Clear Signals” describes EPIG, the first nickel-free PCB coating – now in successful use by Superior Processing, which also plates ENIG, ENEPIG, EG, electrolytic nickel and gold. EPIG is gold wire bondable and solderable, and a huge boon for HF and medical device applications. Also discussed: TWX-40 reduction-assisted immersion gold, for thicker gold demands on ENEPIG.
View the PDF / View previous newsletter

     
MEC PCB Solutions
 

MEC surface treatments to promote adhesion of dry film, soldermask and laminate, are described in a new brochure.
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Connectors and Sensors Line Card
 

• Miralloy 2851 for HF connectors, contact elements, solder pins
• Palluna 468 electrolyte for high-speed deposition of palladium nickel
• Antitarnish 616 PLUS for plug connectors, other electronics
• Niphos 967 for connectors
• Hard and soft gold electrolytes
View the PDF

 
General Metal Finishing Line Card
 

• Advanced Plating Alternatives
• Electroless Nickel
• Decorative Finishes
View the PDF

 
Final Finishes & Acid Copper Plating Line Cards
 

• ENIG & ENEPIG Processes
• Through-hole plating
• Via Filling
• Copper Etching
View the PDF

 

 

 


UYEMURA Corporate Headquarters:

3990 Concours, #425 • Ontario, CA 91764 • ph: (909) 466-5635

 


   
   
Semiconductor Finishes:  
   
General Metal Finishes:  
 
   
   

 

The Indian Space
Research Organization
as put in orbit, an ultra-
low cost space probe.
Read how they did it - using exclusively
Uyemura chemistry
for mission-critical PCBs!