Newsletters, Articles and Literature

NSS Performance Test UMICORE Antitarnish 616 Plus

Platinized Titanium and MMO Anodes in Electroplating Applications

Electrolytic Nickel-Phosphorus Plating

New Nickel Phosphorus Electrolytes Make Plating Jobs Easier

Business Development Manager Rich DePoto discusses the significance of new electrolytic nickel-phos technology for manufacturers of high frequency wireless devices with Modern Metals writer Lynn Stanley.
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Bright Lights, Big Finish for Electronics Plater

Products Finishing Editor Tim Pennington profiles Berquist Company, the only facility in the world dedicated exclusively to the production of insulated metal substrates, a thermal management solution for higher watt-density surface mount applications.
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EN Plating Control Technology

Brochure describes STARLiNE DASH technology for automated sampling, analysis and replenishment of EN baths with exceptional accuracy.
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Advanced Plasma Technology

Uyemura International Corporation and Europlasma NV (Oudenaarde, Belgium) have brought advanced vacuum plasma treatment technology (Nanofics®) to electronic manufacturing companies (EMS) and board makers in the US, Canada and Mexico.
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Surface Performance Newsletter

Fall 2017 Newsletter profiles New England powerhouse, Unimetal, its experience with advanced trimetal technology and organic nanotech sealants, and its moves toward closed loop operation. Business Development Manager Rich DePoto explains the essentials of REACH– a must for US mfgs. selling into the EU. Also: a cyanide-free, semi-bright copper electroplate that’s an ideal base for bright nickel, chrome, gold.
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ClearSignals Newsletter

New edition of “Clear Signals” profiles Eagle Electronics’ strategy for success with advanced board designs, and its experience with UIC’s EVF-R Copper plating for filling blind vias. Also featured: articles by George Milad on the most recent updates re: IPC 4552A, and new information on the use of TWX-40 for achieving heavier gold deposits on ENEPIG.
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MEC PCB Solutions

MEC surface treatments to promote adhesion of dry film, soldermask and laminate, are described in a new brochure.
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Connectors and Sensors Line Card

• Miralloy 2851 for HF connectors, contact elements, solder pins
• Palluna 468 electrolyte for high-speed deposition of palladium nickel
• Antitarnish 616 PLUS for plug connectors, other electronics
• Niphos 967 for connectors
• Hard and soft gold electrolytes
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General Metal Finishing Line Card

• Advanced Plating Alternatives
• Electroless Nickel
• Decorative Finishes
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Final Finishes

  • • ENIG “Gen 3”
  • • ENEPIG “2.0”
  • • EPIG
  • • Immersion Gold
  • • Electroless Gold
  • • Immersion Silver
  • View the PDF

Acid Copper Plating

• Through-hole Plating
• Via Filling, including Void-free Blind Via Fill
• Copper Etching
• FlatBOND Copper Surface Treatment
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