Newsletters, Articles and Literature

NSS Performance Test UMICORE Antitarnish 616 Plus

Platinized Titanium and MMO Anodes in Electroplating Applications

Electrolytic Nickel-Phosphorus Plating

New Nickel Phosphorus Electrolytes Make Plating Jobs Easier

Business Development Manager Rich DePoto discusses the significance of new electrolytic nickel-phos technology for manufacturers of high frequency wireless devices with Modern Metals writer Lynn Stanley.
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Bright Lights, Big Finish for Electronics Plater

Products Finishing Editor Tim Pennington profiles Berquist Company, the only facility in the world dedicated exclusively to the production of insulated metal substrates, a thermal management solution for higher watt-density surface mount applications.
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EN Plating Control Technology

Brochure describes STARLiNE DASH technology for automated sampling, analysis and replenishment of EN baths with exceptional accuracy.
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Advanced Plasma Technology

Uyemura International Corporation and Europlasma NV (Oudenaarde, Belgium) have brought advanced vacuum plasma treatment technology (Nanofics®) to electronic manufacturing companies (EMS) and board makers in the US, Canada and Mexico.
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Surface Performance Newsletter

Spring 2017 GMF Newsletter profiles Accent Plating (Pawtucket,RI) a leader in high end costume jewelry plating, and describes its successes with black finishes, gold, silver, palladium and other precision metals. In his editorial, “How Black is YOUR Black?” Business Development Manager Rich DePoto explores the industry’s blackest-available finish technology, and the new morphology that makes it possible.
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ClearSignals Newsletter

Latest “Clear Signals” describes EPIG, the first nickel-free PCB coating – now in successful use by Superior Processing, which also plates ENIG, ENEPIG, EG, electrolytic nickel and gold. EPIG is gold wire bondable and solderable, and a huge boon for HF and medical device applications. Also discussed: TWX-40 reduction-assisted immersion gold, for thicker gold demands on ENEPIG.
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MEC PCB Solutions

MEC surface treatments to promote adhesion of dry film, soldermask and laminate, are described in a new brochure.
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Connectors and Sensors Line Card

• Miralloy 2851 for HF connectors, contact elements, solder pins
• Palluna 468 electrolyte for high-speed deposition of palladium nickel
• Antitarnish 616 PLUS for plug connectors, other electronics
• Niphos 967 for connectors
• Hard and soft gold electrolytes
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General Metal Finishing Line Card

• Advanced Plating Alternatives
• Electroless Nickel
• Decorative Finishes
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Final Finishes & Acid Copper Plating Line Cards

• ENIG & ENEPIG Processes
• Through-hole plating
• Via Filling
• Copper Etching
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