PCB Processes: Through-hole Plating

Thru-Cup EPL

Thru-Cup EPL “high throwing power” acid copper additive is designed for high aspect ratios with fine line circuitry. It offers the simplicity of DC plating with results that compete favorably with complex waveforms of pulse plating.

The EPL Very High Aspect Ratio (25:1) plating process delivers greater than 60% throw, with zero dog-boning at the hole entrance. The chemistry is very stable and does not require continuous regeneration.

The process produces a fine-grained equiaxed copper deposit. The leveling capability of Thru-Cup EPL overcomes irregularities on the substrate and prevents nodule growth. The deposit is bright and ductile with excellent elongation, tensile strength and metallurgical properties. Thru-Cup EPL maintains these metallurgical properties, plating as low as 5 ASF (0.5 ASD) and as high as 25 ASF (2.5ASD).

Thru-Cup EPL is a two-component system. The suppressor incorporates a carrier and a leveling component and controls deposit thickness uniformity; the brightener is the grain-refining additive. The solution components and additives have a wide operating window and are easily controlled by standard analytical methods.

Thru-Cup EPL is compatible with both air agitation and eductor agitation and both soluble and insoluble anodes. The insoluble anodes are titanium mesh coated with a mixed metal oxide (MMO).

Uyemura Thru-Cup EPL Acid Copper and ENIG Pass More Than 2000 Cycles of IST Testing

Thru-Cup ETN

An acid copper additive for printed wiring board plating. It is ideally suited for vertical conveyorized lines where plating speed is critical, and plates with current densities as high as 40 ASF or 4.0 ASD.

The process produces a fine-grained equiaxed copper deposit. The leveling capability of Thru-Cup ETN overcomes substrate irregularities and does not allow nodule growth. The deposit is bright and ductile, with excellent elongation, tensile strength and metallurgical properties. The chemistry is exceptionally stable and does not require continuous regeneration.

Thru-CUP ECD-CF

Thru-CUP ECD-CF is a high-speed copper process for use with insoluble anodes. It operates at up to 40 ASF current density and provides excellent performance for BVH immediately following make-up. Throwing power remains high despite bath aging. ECD-CF is easily controlled with CVS measurement.

EVF-YF-4

EVF-YF-4 fills through-holes and blind vias, and pattern plates with exceptional uniformity. It maintains excellent tensile and elongation throughout bath aging, and is easily controlled by CVS.

Thru-Cup AC-90

A single-component acid copper additive system designed for simplicity. It is a mixture of carrier and brightener that has a wide operating window for general-purpose plating. The additives are mixed in the proper ratio for use as a single component system.

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