UIC National Accounts Manager for Technology George Milad will chair Managing Water Usage to Minimize Waste Treatment during NASF’s Sur-Fin, the premier conference dedicated to surface technology, June 4-6 at Cleveland’s Huntington Convention Center.
He will also co-chair a second session, “Sustainability Research for Electronics & Surface Finishing” and deliver an important talk on mitigating nickel corrosion in ENEPIG deposits.
A new Uyemura technology, TWX-40, allows gold deposits of up to 8μin in ENIG and ENEPIG processing, in a single step.
TWX-40 is a reduction-assisted immersion gold bath that deposits gold using both immersion and autocatalytic (electroless) reactions.
The autocatalytic feature allows the gold to build without attacking the electroless nickel layer. Deposit uniformity is independent of pad sizes and PCB surface geometry or residual capacitance potential.
TWX-40 gold electrolyte plates directly on electroless palladium or nickel without intermediate activation. The bath exhibits excellent stability and fine geometry edge resolution. Best results are achieved when the bath is used with UIC’s Talon electroless palladium baths as the underlayer for PWBs and IC packages. more
Richard DePoto, Uyemura Business Development Manager, and Mark Eonta, National Sales Manager, will both speak this year at NASF’s Sur-Fin, June 4-6 in Cleveland.
DePoto’s presentation will discuss the development of a new plating technology that deposits high ductility copper directly onto aluminum alloy substrates without costly zincate pretreatment.
Eonta will present on electroless copper, a valuable alternative to electroless nickel, and its use in POP and other applications, during “Surface Finishing Boot Camp,” a popular annual feature of Sur-Fin conferences.
Uyemura CEO Honored for Service, Contributions
Uyemura CEO Tony Revier, shown with his wife, Mary Anne, after receiving the University of La Verne’s 125 Most Notable Graduates Award.
Uyemura President and CEO Tony Revier has twice been recognized by his alma mater, the University of La Verne, (La Verne, CA), an institution widely known for its influential business and public management programs.
Revier was honored as one of the University’s 125 Most Notable Graduates at a ceremony commemorating the 125th anniversary of the university. The awards were given by University President Devorah Lieberman to alumni based on four criteria. Honorees had made unique and significant contributions to the university, had a distinguished history of community service, had excelled in business, and had created a positive work environment for their employees. The awards were announced at an alumni ceremony.
Previously, Revier was selected by the university to join its Board of Trustees.
Revier received his MBA from La Verne in 1993, and has also served on its College of Business & Public Management Advisory Board. He has been CEO of Uyemura USA since 1988.
Uyemura announces Talon 3 electroless palladium, a groundbreaking technology in board chemistry that allows plating directly onto copper. This development paves the way for EPIG – electroless palladium / immersion gold, a nickel-free alternative that becomes more consequential as lines become tighter and space more critical.
The EPIG finish made possible with Talon 3 electroless palladium solders perfectly after eight hours of steam aging – a significant achievement. The process was developed by Uyemura’s Connecticut Tech Center, one of the industry’s most renowned facilities for the development and testing of board chemistries. more
Uyemura, and its European affiliate, Umicore, announce a series of European REACH-compliant (nickel-free) plating solutions for manufacturers of metal components.
The use of nickel in consumer objects has long been regulated by the European Nickel Act. Recently, a tightening of regulations, related to the degree and frequency of skin contact, has been adopted. This has resulted in many items that were not previously affected to be covered.
REACH-compliant solutions provided by Uyemura include Miralloy, a copper/tin/ zinc alloy that replaces silver, palladium and nickel for a many applications, and Palluna 457, a pure palladium that’s low in porosity, corrosion resistant, and builds crack-free layers of 3 μm and higher.
I-Connect007 Interviews Rich DePoto at IPC APEX 2018